Certification Section
Certification Section
Minghsin University of Science and Technology
Ph.D. Program in Semiconductor Technology Certification Examination Section
▶ Semiconductor Packaging and Testing Competency Assessment
Taiwan has transformed its industrial and economic structure through the integrated circuit industry, and semiconductor technology has enabled Taiwan to gain global recognition. According to the Industry, Science and Technology International Strategy Center (ISTI) under the Institute for Information Industry (III), Taiwan’s semiconductor industry continued to outperform the global market in 2022, reaching an annual output value of NT$4.3 trillion, making it one of the key pillars of Taiwan’s economy. Taiwan ranked first globally in both professional wafer foundry and semiconductor packaging and testing output value.
Due to the declining labor force caused by the falling birth rate, the shortage of semiconductor talent has become even more severe than previously estimated by the National Development Council. The “Semiconductor Talent White Paper” published by 104 Job Bank in 2022 pointed out that although the COVID-19 pandemic impacted the global economy, the semiconductor industry experienced rapid growth, leading to an equally strong demand for talent.
Looking back at 2022, the Industry Intelligence and Forecasting Institute (MIC) reported that Taiwan’s semiconductor industry achieved an annual production value of NT$4.3 trillion with a growth rate of 15.8%. Looking ahead to 2023, the Industrial Technology Research Institute (ITRI) estimated that Taiwan’s semiconductor industry output value would continue rising to NT$5.0 trillion, with an annual growth rate of 5.6%, significantly outperforming the global growth rate of -3.6%.
Given the highly specialized and technically complex nature of the semiconductor industry, combined with the ongoing decline in birth rates, the supply of qualified talent remains insufficient in both quantity and speed. Semiconductor companies therefore anticipate continued talent shortages over the next three years.
Located near the Hsinchu Science Park and the Hsinchu Industrial Park, Minghsin University of Science and Technology is strategically positioned within the Taoyuan-Hsinchu-Miaoli high-tech industrial corridor. The University maintains close industry-academia collaboration with surrounding enterprises.
To address the urgent workforce demands of the semiconductor industry, the University has actively aligned with the government’s semiconductor development policies. Supported by nearly NT$50 million in funding from the Ministry of Education’s “Optimization Program for Practical Training Environments in Technical Colleges,” the University implemented the “Semiconductor Packaging and Testing Talent Cultivation Program.” This initiative established a “Semiconductor Packaging and Testing Demonstration Production Line” on campus, providing students with employment-oriented practical training environments that allow them to become familiar with industrial operations, equipment, and production processes during their studies, thereby fulfilling the goal of integrating academic learning with practical application.
In support of the government’s Youth Employment Investment Program and the cultivation of professional technical talent in six major strategic industries, the Ministry of Education launched the “Regional Industry Talent and Technology Cultivation Base Program” in 2022. Minghsin University of Science and Technology was among the first approved institutions, receiving NT$90 million in government funding, supplemented by an additional NT$50 million contributed by the University. Together, the total investment of NT$140 million was used to establish the “Semiconductor Industry Equipment, Facility, and Testing Talent Cultivation Base” on campus. The objective is to cultivate practical professionals in semiconductor equipment development, maintenance, packaging, testing, quality control, and facility engineering.
This year, the University will continue collaborating with the Smart Electronics College under the Ministry of Economic Affairs to promote the “Semiconductor Packaging Engineer Competency Assessment” certification examination. Candidates who pass the examination will receive a Semiconductor Packaging Engineer Certification jointly issued by the Smart Electronics College and the Taiwan Electrical and Electronic Manufacturers' Association.
In 2023, to further expand the impact of the certification program, the University launched the second annual IC Packaging Engineer Training Program for newly recruited employees of IC technology companies and provided guidance to help participants obtain Packaging Engineer certifications. This integrated “training–certification–employment” model not only addresses workforce shortages in the IC industry but also helps students realize their career aspirations in semiconductor packaging and testing.
▶ Features and Advantages
Features
The competency assessment system is developed based on industry occupational requirements and is planned and implemented by professional committees from industry, academia, and research sectors.
The certification program is administered by professional organizations, and certificates are jointly issued by the Smart Electronics College of the Industrial Development Administration and the Taiwan Electrical and Electronic Manufacturers' Association.
Advantages
Competency assessment results serve as benchmarks for evaluating professional knowledge and practical skills while comprehensively enhancing individual learning capability, employability, and competitiveness.
Certified candidates gain priority recognition, improving opportunities for interviews, employment, and salary advancement.
▶ 1.3 Organizing Units
Supervising Organization:
Industrial Development Administration, Ministry of Economic Affairs
Project Implementation Unit:
Institute for Information Industry (III)
Certification Unit:
Minghsin University of Science and Technology
▶ Competency Indicators
Recommended Applicants by Professional Level
Engineer Level
Applicants who meet one of the following qualifications are recommended to apply:
Junior-year university students or first-year students in a two-year technical college program who have completed at least 6 credits related to semiconductor packaging engineering.
College graduates with at least two years of relevant work experience.
Applicants holding a bachelor’s degree or above who have completed at least 80 hours of Semiconductor Packaging Engineer competency training courses and can provide a certificate of completion.
▶ For More Information
For related certification examinations and detailed information, please refer to:
Minghsin University of Science and Technology – Semiconductor Technology Center
https://acade.must.edu.tw/index.aspx?
