助理教授

徐偉成 專案助理教授

徐偉成

Email

william.wchsu@must.edu.tw

電話

03-5593142轉 3354

研究室

化材館303

學歷

國立交通大學 電子研究所


經歷

TSMC, Hsinchu — Principal Engineer, Advanced Module Technology
2003 – 2006
 • Diagnosed 65nm SRAM array bit-fail mechanisms via inline SEM/FIB, improving
standby noise margin.
 • Developed semi-auto transistor array measurement system with Agilent 41000,
improving data resolution 2×.
UMC, Hsinchu — Reliability Staff Engineer
2006 – 2008
 • Established 55/65nm WLR methodology, reducing GOI test time by 20%.
 • Implemented Flash endurance in in-line monitor; awarded Excellent Teaching
Materials (2008).
Vanguard International Semiconductor, Hsinchu — Reliability Principal Engineer
2008 – 2011
 • Qualified 0.3μm PMIC/BCD HV devices (Vddmax 40V) with accelerated HCI analysis.
 • Managed 200V HV tester certification, enhancing QA coverage.
 • Recipient of Customer Special Service Award (2011).
Socle Technology Inc., Hsinchu — NPE Department Manager
2011 – 2012
 • Led 65G logic product improvement; IDDQ reduced 30%, yield improved from
55%→85%.
 • Standardized FA process, cutting debug time by 40%.
Afa-Micro Inc., Hsinchu — QRA Department Manager
2012 – 2013
 • Established QRA department including DCC, QC, and QE functions.
 • Managed g-sensor reliability qualification and ESD/Latch-up validation.
 • Improved customer return handling with structured 8D problem-solving.
Voltafield Technology Inc., Hsinchu — QRA Division Manager
2013 – 2015
 • Built complete Quality Management System (ISO9001:2008).
 • Defined sensor qualification guidelines (JESD47I), improving product reliability
metrics.
 • Coordinated subcontractor audits, QC flow, and SPC monitoring; improved assembly
yield by 15%.
CytoAurora Biotechnology Inc., Hsinchu — Principal Semiconductor Engineer
2016 – Present
 • Led biochip nanowire structure development using metal-assisted chemical etching,
reducing fabrication cost by 30%.
 • Established in-house laser cutting & traceability systems, shortening prototype cycle
time by 25%.
 • Developed surface modification and verification process, enabling biochip
commercialization.
 • Researched phototransistor-based optical sensing, optimizing implantation/annealing
parameters for biocompatibility.


研究興趣

半導體元件物理與積體電路技術、材料分析、可靠度技術


年份 標題
2026 產學合作經驗分享及教師進行產業研習或研究說明