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03-5593142-3001 Tel
   
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  Associate Professor  
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Name Hsin-Chun Tsai
   
Title Associate Professor
   
E-mail thc0130@msut.edu.tw
   
Tel 03-5593142ext.3002
   
Education & Experience Chung Yuan Christian University,Ph.D.
   
Discipline Precision Measuring Equipment&Parts Measurement;
Microsystems Packaging&Techniques;
   
Major in Precision Measuring & Parts Measurement;
Microsystems Packaging&Techniques;
   
Other A. JOURNAL PAPERS

1. W. R. Jong, H. C. Tsai, H. T. Chang, and S. H. Peng, “The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method”, Transactions of the ASME, Journal of Electronic Packaging, to be appeared.

2. H. C. Tsai and W. R. Jong, Aug. 2007, “The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading”, Journal of Reinforced Plastics and Composites, Vol. 26, Number 12, pp. 1211-1223.

3. W. R. Jong, S. C. Chen, H. C. Tsai,, C. C. Chiu, and H. T. Chang, Jan 2006, “The Geometrical Effects of Bumps on the Fatigue Life of Flip-chip Packages by Taguchi Method”, Journal of Reinforced Plastics and Composites, Vol. 25, Number 1, pp. 99-114.

B. CONFERENCE PAPERS

1. W. R. Jong, H. C. Tsai, and S. H. Peng, May 2007, “The comparisons of IC packages with/without underfill on the thermo-mechanical characteristics”, SPE Technical Papers, Vol. 51, pp. 1444-1448.

2. W. R. Jong, H. C. Tsai, C. C. Chiu, and H. T. Chung, May 2005, “Elastic-Plastic-Creep Analysis of Lead and Lead-Free Solder”, SPE Technical Papers, Vol. 51, pp. 1665-1669.

3. W. R. Jong, C. C. Chiu, H. C. Tsai, and C. A. Hsiao, May 2004, “The Analysis on the Fatigue Life of Flip-Chip Package Under Cyclic Thermo-mechanical Loading”, SPE Technical Papers, Vol. 50, pp. 1694-1698.

4. 鍾文仁, 蔡新春, 黃靜慈, Nov. 2007, “元素分割對Sn-Ag-Cu錫球合金之潛變行為的影響”, 中國機械工程學會第二十四屆全國學術研討會, CSME 5399-5404, E04-0026.

5. 鍾文仁, 蔡新春, 黃靜慈, Nov. 2007, “Sn-Ag-Cu錫球合金之PBGA封裝體疲勞強度的比較”, 中國機械工程學會第二十四屆全國學術研討會, CSME 5393-5398, E04-0025.

6. W. R. Jong and H. C. Tsai, and C. T. Huang, Oct. 2007, “Fatigue Life Predictions of Solder Joint under Thermal Cyclic Loading”, International Microsystems, Packaging, Assembly and Circuits Technology conference (IMPACT2007), pp. 293-296.

7. W. R. Jong and H. C. Tsai, Oct. 2006, “The Thermo-Mechanical Behaviors of Lead-Free Packages Subjected to Temperature Cyclic Loading”, 第三屆兩岸三地先進成型技術與材料加工研討會, pp. 128-131.

8. 鍾文仁, 蔡新春, 張秀桃, Nov. 2005, “溫度循環參數對晶圓級封裝之無鉛銲錫的影響”, 中國機械工程學會第二十二屆全國學術研討會, E5-012.

9. 鍾文仁, 劉鴻汶, 賴成展, 蔡新春, Dec. 2003, “基於等效控制之3D高密度金線偏移分析”, 中國機械工程學會第二十屆全國學術研討會, 頁 703-710.
   
 

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